Invention Grant
- Patent Title: Amplifier
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Application No.: US17043862Application Date: 2018-05-28
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Publication No.: US11303254B2Publication Date: 2022-04-12
- Inventor: Shohei Hatanaka , Katsuya Kato
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2018/020320 WO 20180528
- International Announcement: WO2019/229796 WO 20191205
- Main IPC: H03F3/24
- IPC: H03F3/24 ; H01L23/00 ; H03F3/68

Abstract:
An amplifier includes: a first transistor chip including a plurality of cells and provided beside an input matching substrate; a second transistor chip including a plurality of cells and provided beside the input matching substrate; a plurality of first bonding wires connecting the input matching substrate and the first transistor chip; and a plurality of second bonding wires connecting the input matching substrate and the second transistor chip, and variance of the mutual inductance of the first bonding wires and the second bonding wires is compensated by adjusting the self-inductance of the first bonding wires and the second bonding wires.
Public/Granted literature
- US20210143781A1 AMPLIFIER Public/Granted day:2021-05-13
Information query
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