Invention Grant
- Patent Title: Camera module having a reinforcing portion coupling a surface of a first circuit board and a terminal of a second circuit board
-
Application No.: US17172391Application Date: 2021-02-10
-
Publication No.: US11303787B2Publication Date: 2022-04-12
- Inventor: Jong Ho Chung , Sung Il Lee
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2015-0155557 20151106,KR10-2015-0169957 20151201
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G02B7/08 ; G02B27/64 ; H05K3/30 ; G02B7/00 ; G02B7/09 ; H05K1/02 ; H05K1/14 ; H05K3/34 ; H05K1/03

Abstract:
A camera module of an embodiment may comprise: a first holder in which a filter is mounted; a lens barrel that is provided to be vertically movable in a first direction with respect to the first holder; a lens operating device that comprises a terminal and moves the lens barrel in the first direction; a first circuit board that is disposed under the first holder and on which an image sensor is mounted; a soldering portion for electrically connecting the terminal of the lens operating device to the first circuit board; and a coupling reinforcement portion that is disposed to face the soldering portion and couples the lens operating device and the first circuit board.
Public/Granted literature
- US20210168267A1 CAMERA MODULE Public/Granted day:2021-06-03
Information query