Invention Grant
- Patent Title: Induction heating device having improved switch stress reduction structure
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Application No.: US16353655Application Date: 2019-03-14
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Publication No.: US11304267B2Publication Date: 2022-04-12
- Inventor: Seungbok Ok , Dooyong Oh , Jae-Woo Lee
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Fish & Richardson P.C.
- Priority: KR10-2018-0120562 20181010
- Main IPC: H05B6/06
- IPC: H05B6/06 ; H05B6/12

Abstract:
An induction heating device includes first and second working coils connected electrically in parallel, an inverter unit configured to switch at least one of the first working coil or the second working coil, an inverter driving unit connected to the inverter unit; a first semiconductor switch connected to the first working coil, a first semiconductor switch driving unit connected to the first semiconductor switch, an over-current protection unit connected to the first semiconductor switch, configured to generate information based on a current that flows in the first semiconductor switch, and configured to, based on the information, determine whether to turn off the inverter driving unit, and a control unit that is configured to receive the information, and determine, based on the information, whether to block a pulse signal to the inverter driving unit and whether to turn off the first semiconductor switch driving unit.
Information query