Invention Grant
- Patent Title: Method for shielding system-in-package assemblies from electromagnetic interference
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Application No.: US17039102Application Date: 2020-09-30
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Publication No.: US11304346B2Publication Date: 2022-04-12
- Inventor: Xuan Hong , Daniel Maslyk , Qizhuo Zhuo , Juliet Grace Sanchez
- Applicant: HENKEL IP & HOLDING GMBH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent Steven C. Bauman
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/78 ; H05K9/00 ; H05K1/02
Abstract:
A method for shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) includes laminating a pre-form EMI shielding film onto the assembly in a single lamination process. The EMI shielding film may be moldable in a vacuum lamination process to cover the SIP assembly and to substantially fill trenches formed in the assembly between adjacent component modules. The SIP assembly is accordingly shielded from EMI through the application of a single EMI shielding film.
Public/Granted literature
- US20210092884A1 METHOD FOR SHIELDING SYSTEM-IN-PACKAGE ASSEMBLIES FROM ELECTROMAGNETIC INTERFERENCE Public/Granted day:2021-03-25
Information query
IPC分类:
