System and methods for microfabrication
Abstract:
A method comprising: adhering a first surface of a mask to a carrier substrate via a first adhesive layer; forming a second adhesive layer on at least one of a second surface of the mask or a third surface of a wafer having a second alignment mark; bringing the carrier substrate and the wafer towards each other along a vertical axis such that the second surface of the mask and the third surface of the wafer is separated by an alignment gap based on a thickness of the second adhesive layer; performing an alignment operation based on imaging the first alignment mark and the second alignment mark; configuring the second surface of the mask to adhere to the third surface of the wafer via the second adhesive; and disconnecting the carrier substrate from the mask.
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