Invention Grant
- Patent Title: System and methods for microfabrication
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Application No.: US17360128Application Date: 2021-06-28
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Publication No.: US11305987B2Publication Date: 2022-04-19
- Inventor: Sae Won Lee , Qin Zhou , Youmin Wang
- Applicant: Beijing Voyager Technology Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing Voyager Technology Co., Ltd.
- Current Assignee: Beijing Voyager Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81C3/00 ; G02B26/08 ; G01S17/931

Abstract:
A method comprising: adhering a first surface of a mask to a carrier substrate via a first adhesive layer; forming a second adhesive layer on at least one of a second surface of the mask or a third surface of a wafer having a second alignment mark; bringing the carrier substrate and the wafer towards each other along a vertical axis such that the second surface of the mask and the third surface of the wafer is separated by an alignment gap based on a thickness of the second adhesive layer; performing an alignment operation based on imaging the first alignment mark and the second alignment mark; configuring the second surface of the mask to adhere to the third surface of the wafer via the second adhesive; and disconnecting the carrier substrate from the mask.
Public/Granted literature
- US20210323815A1 SYSTEM AND METHODS FOR MICROFABRICATION Public/Granted day:2021-10-21
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