A pressure sensitive adhesive composition is described. The pressure sensitive adhesive composition includes a polymerization product of a monomer mixture. The monomer mixture includes the following components: (a) at least one alkyl ester of (meth)acrylic acid or cyclic hydrocarbon acrylates; (b) at least one vinyl ester of a C4-C20 carboxylic acid; (c) at least one hydroxyl functional (meth)acrylate monomer, or at least one epoxy functional (meth)acrylate monomer; (d) at least one ureido substituted ethylenically unsaturated monomer; and one or more optional monomer components (e)-(g). The pressure sensitive adhesive composition provides a desirable combination of low and high temperature performance, and good adhesion to both metal and organic polymer surfaces.