Invention Grant
- Patent Title: Powder mixture
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Application No.: US16500042Application Date: 2018-03-30
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Publication No.: US11306207B2Publication Date: 2022-04-19
- Inventor: Shuji Sasaki , Yuzo Nakamura , Kohki Ichikawa
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-074575 20170404
- International Application: PCT/JP2018/013956 WO 20180330
- International Announcement: WO2018/186315 WO 20181011
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08K3/36 ; C08K7/18 ; C09C1/00 ; H01L23/29

Abstract:
A powder mixture including spherical barium titanate particles and spherical oxide particles and having an average particle diameter of 2 μm or more and 30 μm or less, wherein the spherical oxide particles have an average particle diameter of 0.05 μm or more and 1.5 μm or less, and the spherical oxide particles are contained in an amount of 0.02% by mass or more and 15% by mass or less based on the powder mixture. The spherical oxide particles are preferably amorphous silicon dioxide particles and/or aluminum oxide particles. According to the present invention, it is possible to provide a spherical barium titanate-based powder which enables to prepare a high dielectric resin composition with which reduced wire sweep amount and burr are achieved.
Public/Granted literature
- US11352503B2 Powder mixture Public/Granted day:2022-06-07
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