Invention Grant
- Patent Title: High molecular weight polystyrene in inks and coatings
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Application No.: US16906374Application Date: 2020-06-19
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Publication No.: US11306216B2Publication Date: 2022-04-19
- Inventor: Michael J. Jurek , John G. Tiessen , Soichiro Omizu , Juanita M. Parris
- Applicant: SUN CHEMICAL CORPORATION
- Applicant Address: US NJ Parsippany
- Assignee: SUN CHEMICAL CORPORATION
- Current Assignee: SUN CHEMICAL CORPORATION
- Current Assignee Address: US NJ Parsippany
- Agency: Ostrolenk Faber LLP.
- Agent Marian E. Fundytus
- Main IPC: C09D7/20
- IPC: C09D7/20 ; C09D11/101 ; C09D11/108 ; C09D125/06 ; C09D4/06 ; C09D11/033

Abstract:
Described herein are depolymerized polystyrene resins derived from polystyrene source resins. The depolymerized polystyrene resins undergo a depolymerization in which chemical bonds are cleaved, producing depolymerized polystyrene resins of lower molecular weight. The polystyrene resins may be modified by chemical reaction with monomers, polymers, and oligomers, such as acrylates thereof. Also described are ink and coating compositions that include the depolymerized and modified polystyrene resins.
Public/Granted literature
- US20200317939A1 HIGH MOLECULAR WEIGHT POLYSTYRENE IN INKS AND COATINGS Public/Granted day:2020-10-08
Information query
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