- Patent Title: Double-sided adhesive tape, electronic instrument provided with double-sided adhesive tape, disassembly structure provided with double-sided adhesive tape, and adhered structure
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Application No.: US15554165Application Date: 2016-04-20
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Publication No.: US11306223B2Publication Date: 2022-04-19
- Inventor: Masahiko Mitsuboshi
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2015-144213 20150721
- International Application: PCT/JP2016/062477 WO 20160420
- International Announcement: WO2017/013914 WO 20170126
- Main IPC: C09J7/38
- IPC: C09J7/38 ; C09J5/06 ; B32B5/20 ; C09J201/00 ; C09J7/20 ; C09J7/30 ; C09J9/02 ; C08K9/10 ; C08K3/08 ; H01M50/20 ; H05K1/18

Abstract:
Provided is an adhesion technology that can separate adherends with their recycling as a premise while meeting their reliability guarantee temperature conditions. A double-sided, pressure-sensitive adhesive tape includes a pair of pressure-sensitive adhesive layers and an electrically-conductive heat generating layer disposed between the paired pressure-sensitive adhesive layers. At least one of the paired pressure-sensitive adhesive layers contains a heat-foaming agent, and at least one of opposite end faces of the electrically-conductive heat generating layer extends out beyond a corresponding end face of the at least one pressure-sensitive adhesive layer.
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