Invention Grant
- Patent Title: Device for microelectrodeposition through laser assisted flexible following tool electrode and deposition method using the device thereof
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Application No.: US17296552Application Date: 2020-01-19
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Publication No.: US11306408B2Publication Date: 2022-04-19
- Inventor: Zhaoyang Zhang , Yucheng Wu , Kun Xu , Xueren Dai , Anbin Wang , Qinming Gu , Hong Wang
- Applicant: Jiangsu University
- Applicant Address: CN Jiangsu
- Assignee: Jiangsu University
- Current Assignee: Jiangsu University
- Current Assignee Address: CN Jiangsu
- Agency: JCIP Global Inc.
- Priority: CN201910125271.2 20190220
- International Application: PCT/CN2020/072902 WO 20200119
- International Announcement: WO2020/168881 WO 20200827
- Main IPC: C25D5/02
- IPC: C25D5/02 ; C25D5/04 ; C25D5/18 ; C25D21/06 ; C25D21/10

Abstract:
Disclosed are a device and a method for microelectrodeposition through a laser assisted flexible following tool electrode. Localization of electrodeposition and dimensional precision of members are enhanced by using the flexible following tool electrode to restrict a dispersion region of an electric field and a reaction region of electrodeposition, and a complex-shaped member can be deposited by controlling a motion path of the flexible following tool electrode. Since a laser has a high power density, introducing laser irradiation changes an electrode state in a radiated region, accelerates ion diffusion and electron transfer speeds, and increases a deposition rate, thus reducing defects such as pitting and cracking in a deposit, enhancing deposition quality, and achieving fabrication of a micro-part by a synergistic action of both electrochemical energy and laser energy.
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