Invention Grant
- Patent Title: Thermal barrier for downhole flasked electronics
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Application No.: US15954224Application Date: 2018-04-16
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Publication No.: US11306578B2Publication Date: 2022-04-19
- Inventor: Michael Joseph Mannas , Dominik Hoheisel , Thomas Kruspe , Sebastian Jung
- Applicant: Baker Hughes, a GE company, LLC
- Applicant Address: US TX Houston
- Assignee: Baker Hughes, a GE company, LLC
- Current Assignee: Baker Hughes, a GE company, LLC
- Current Assignee Address: US TX Houston
- Agency: Cantor Colburn LLP
- Main IPC: E21B47/01
- IPC: E21B47/01 ; E21B47/017 ; F28F7/02 ; E21B36/00

Abstract:
Apparatus and methods directed to an assembly associated with a downhole tool, and including: a thermal housing; at least one internal component inside the thermal housing, wherein the at least one internal component comprises at least one thermally sensitive component; and a thermal isolation support connecting the at least one internal component to the tool. The thermal isolation support may comprise an additive manufacturing structural framework connected to the tool. The structural framework may include a plurality of structural members, with a majority of the plurality of structural members substantially non-parallel with a longitudinal axis of the downhole tool.
Public/Granted literature
- US20190316460A1 THERMAL BARRIER FOR DOWNHOLE FLASKED ELECTRONICS Public/Granted day:2019-10-17
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