Invention Grant
- Patent Title: Temperature plate and heat dissipation device
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Application No.: US15624300Application Date: 2017-06-15
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Publication No.: US11306974B2Publication Date: 2022-04-19
- Inventor: Li-Kuang Tan , Shih-Kang Lin
- Applicant: DELTA ELECTRONICS, INC.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201710417049.0 20170606
- Main IPC: F28D15/02
- IPC: F28D15/02 ; F28D15/04 ; F28F3/06 ; H01L33/64 ; H01L23/427 ; F28F9/007 ; F28D21/00 ; F21V29/74 ; F21Y115/10 ; H01L23/367

Abstract:
A temperature plate includes a plate body and at least two supporters. The plate body has a first plate and a second plate, and a vacuum chamber is defined by the first plate and the second plate. The first plate has a first external surface, and the plate body is bent to form at least two bent portions with the first external surface being a compressive side, and the supporters are disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber to enhance a structural strength of the bent portions and also to improve heat conduction, wherein the temperature plate is combined with a cooling fin assembly, the cooling fin assembly is disposed on the first external surface. When the number of the bent portions are two, the configuration of the two bent portions allows the plate body to clip the cooling fin assembly.
Public/Granted literature
- US20170363366A1 TEMPERATURE PLATE AND HEAT DISSIPATION DEVICE Public/Granted day:2017-12-21
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