Invention Grant
- Patent Title: Single and multi-layer mesh structures for enhanced thermal transport
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Application No.: US17251127Application Date: 2019-06-11
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Publication No.: US11306983B2Publication Date: 2022-04-19
- Inventor: Ronggui Yang , Rongfu Wen , Shanshan Xu , Yung-Cheng Lee
- Applicant: The Regents of the University of Colorado, a body corporate
- Applicant Address: US CO Denver
- Assignee: The Regents of the University of Colorado, a body corporate
- Current Assignee: The Regents of the University of Colorado, a body corporate
- Current Assignee Address: US CO Denver
- Agency: Neugeboren O'Dowd PC
- International Application: PCT/US2019/036516 WO 20190611
- International Announcement: WO2019/241223 WO 20191219
- Main IPC: F28F13/18
- IPC: F28F13/18 ; F25B39/04 ; H01L23/427 ; F28D15/04
Abstract:
This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.
Public/Granted literature
- US20210131753A1 SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT Public/Granted day:2021-05-06
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