An inspection device for inspecting an inspection target substrate includes a probe card, a tester, a plurality of conductive lines, and a resistor. The probe card has probes to be in contact with the inspection target substrate. The tester is configured to transmit and receive electric signals for an inspection to and from the inspection target substrate through the probes. The conductive lines electrically connect the probe card with the tester, and at least a part of the conductive lines is electrically connected to the probes. The resistor is formed at the probe card and serves as an electrical resistor. The tester is further configured to measure a resistance of the resistor based on the electric signals transmitted and received through the conductive lines.