Invention Grant
- Patent Title: On-chip high capacitance termination for transmitters
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Application No.: US16843761Application Date: 2020-04-08
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Publication No.: US11307440B2Publication Date: 2022-04-19
- Inventor: Stephen B. Krasulick , Damien Lambert , Andrew Bonthron , Guoliang Li
- Applicant: Skorpios Technologies, Inc.
- Applicant Address: US NM Albuquerque
- Assignee: Skorpios Technologies, Inc.
- Current Assignee: Skorpios Technologies, Inc.
- Current Assignee Address: US NM Albuquerque
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: G02B6/26
- IPC: G02B6/26 ; G02F1/01 ; G02F1/017 ; H03H7/38 ; G02F1/015
Abstract:
A modulator and a capacitor are integrated on a semiconductor substrate for modulating a laser beam. Integrating the capacitor on the substrate reduces parasitic inductance for high-speed optical communication.
Public/Granted literature
- US20200371383A1 ON-CHIP HIGH CAPACITANCE TERMINATION FOR TRANSMITTERS Public/Granted day:2020-11-26
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