The present invention provides an array substrate. The array substrate includes: a backplane including a display area and a bonding area; a wiring layer provided on the backplane and exposed in the bonding area; a protective layer provided on a surface of the wiring layer away from the backplane and covering the wiring layer in the display area and the bonding area, wherein a through-hole is provided in the protective layer in the boding area; and a connection layer provided on a surface of the protective layer away from the backplane and coupled to the wiring layer through the through-hole.