An FPC connector includes a first insulating layer, a first circuit layer, a second insulating layer, a third insulating layer, and a second circuit layer. The first circuit layer is arranged between the first insulating layer and the second insulating layer. The first circuit layer includes a number of conductive strips. The third insulating layer is arranged between the first insulating layer and the first circuit layer. The second circuit layer includes a number of conductive strips provided on an upper side of the third insulating layer. Ends of the conductive strips of the second circuit layer pass through the third insulating layer and are correspondingly connected to the conductive strips of the first circuit layer. The first circuit layer and the second insulating layer each has a forepart extending beyond a front end of each of the first insulating layer, the third insulating layer, and the second circuit layer.