Invention Grant
- Patent Title: USB integrated circuit
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Application No.: US16662040Application Date: 2019-10-24
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Publication No.: US11308016B2Publication Date: 2022-04-19
- Inventor: Wen-Yu Tseng , Wen-Hao Cheng , Terrance Shiyang Shih
- Applicant: VIA LABS, INC.
- Applicant Address: TW New Taipei
- Assignee: VIA LABS, INC.
- Current Assignee: VIA LABS, INC.
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW108131657 20190903
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42
Abstract:
A USB integrated circuit includes three TX connecting component pairs and three RX connecting component pairs. The first TX connecting component pair and the first RX connecting component pair are respectively coupled to the first TX pin pair and the first RX pin pair of the first USB connector. The second TX connecting component pair and the second RX connecting component pair are respectively coupled to the first TX pin pair and the first RX pin pair of a second USB connector. The third TX connecting component pair is coupled to the second TX pin pair of the first USB connector or to the second TX pin pair of the second USB connector. The third RX connecting component pair is coupled to the second RX pin pair of the first USB connector or to the second RX pin pair of the second USB connector.
Public/Granted literature
- US20210064558A1 USB INTEGRATED CIRCUIT Public/Granted day:2021-03-04
Information query
