A fingerprint sensing module including a substrate, a plurality of photosensitive devices, a collimation structure layer, a light-shielding layer, an interposer and a plurality of micro lenses is provided. The photosensitive devices are disposed on the substrate. The collimation structure layer is disposed on the photosensitive devices. The light-shielding layer is disposed on the collimation structure layer and has a surface and a plurality of first openings recessed from the surface. The first openings respectively overlap the photosensitive devices. The interposer is disposed on the collimation structure layer and positioned in a part of the first openings of the light-shielding layer. The micro lenses are disposed on the interposer and respectively overlap the first openings.