Invention Grant
- Patent Title: Multilayer substrate, actuator, and method of manufacturing multilayer substrate
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Application No.: US16511012Application Date: 2019-07-15
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Publication No.: US11309113B2Publication Date: 2022-04-19
- Inventor: Shingo Ito
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2017-059289 20170324
- Main IPC: H01F7/08
- IPC: H01F7/08 ; H01F7/126 ; H01F27/28 ; H01F7/16

Abstract:
A multilayer substrate includes a stacked body including a principal surface and insulating base material layers made of a thermoplastic resin that are stacked, and a coil including coil conductors. The coil includes a winding axis in a stacking direction. The coil conductors includes a first coil conductor closest to the principal surface, and a second coil conductor adjacent to or in a vicinity of the first coil conductor. The second coil conductor includes a wide portion of which a line width is larger than a line width of the first coil conductor. The wide portion includes an overlapping portion that overlaps with the first coil conductor, and a non-overlapping portion that does not overlap with the first coil conductor, when viewed from the stacking direction. The non-overlapping portion is curved to be closer to the principal surface than to the overlapping portion.
Public/Granted literature
- US20190341180A1 MULTILAYER SUBSTRATE, ACTUATOR, AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE Public/Granted day:2019-11-07
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