Invention Grant
- Patent Title: Electronic component
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Application No.: US16201971Application Date: 2018-11-27
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Publication No.: US11309116B2Publication Date: 2022-04-19
- Inventor: Kouhei Matsuura , Morihiro Hamano , Keiichi Tsuduki
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JPJP2017-229449 20171129,JPJP2018-152033 20180810
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F17/00 ; H01F27/29 ; H01F41/02 ; H01F27/28 ; H01F41/04

Abstract:
An electronic component with a plurality of coil conductor layers laminated such that a coil conductor having a coil pattern on a surface of an insulation layer is formed on each of the plurality of coil conductor layers. The electronic component includes a laminated body in which a bottom face side extended electrode layer, a primary coil conductor layer including a primary coil conductor, a secondary coil conductor layer including a secondary coil conductor, a tertiary coil conductor layer including a tertiary coil conductor, a parallel primary coil conductor layer including a parallel primary coil conductor, and a top face side extended electrode layer are laminated in this order. The electronic component further includes first through sixth external electrodes on a surface of the laminated body, which are connected to the primary, secondary, tertiary and parallel primary coil conductors.
Public/Granted literature
- US20190164677A1 ELECTRONIC COMPONENT Public/Granted day:2019-05-30
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