Invention Grant
- Patent Title: Magnetic field efficient inductor and method thereof
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Application No.: US16229180Application Date: 2018-12-21
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Publication No.: US11309121B2Publication Date: 2022-04-19
- Inventor: Chia-Liang (Leon) Lin
- Applicant: Realtek Semiconductor Corp.
- Applicant Address: TW Hsinchu
- Assignee: Realtek Semiconductor Corp.
- Current Assignee: Realtek Semiconductor Corp.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F5/04 ; H01F27/06 ; H01F27/34 ; H01F41/04 ; H01F5/00 ; H01F27/40

Abstract:
An inductor includes a coil configured in an open loop topology with a first multi-finger end and a second multi-finger end, wherein the fingers of the first end are disposed in interdigitating fashion with the fingers of the second end, and laid out on a first metal layer of a multi-layer structure; a plurality of pairs of metal strips laid out on a second metal layer of the multi-layer structure, wherein each of said plurality of pairs of metal strips comprises a first metal strip intersecting the first multi-finger end as seen from a top view and connecting to the first multi-finger end through a first set of vias, and a second metal strip intersecting the second multi-finger end as seen from the top view and connecting to the second multi-finger end through a second set of vias.
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