Invention Grant
- Patent Title: Semiconductor chip with solder cap probe test pads
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Application No.: US16556105Application Date: 2019-08-29
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Publication No.: US11309222B2Publication Date: 2022-04-19
- Inventor: Lei Fu , Milind S. Bhagavat , Chia-Hao Cheng
- Applicant: ADVANCED MICRO DEVICES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee: ADVANCED MICRO DEVICES, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/768 ; H01L23/00
Abstract:
Various semiconductor chips with solder capped probe test pads are disclosed. In accordance with one aspect of the present invention, a semiconductor chip is provided that includes a substrate, plural input/output (I/O) structures on the substrate and plural test pads on the substrate. Each of the test pads includes a first conductor pad and a first solder cap on the first conductor pad.
Public/Granted literature
- US20210066144A1 SEMICONDUCTOR CHIP WITH SOLDER CAP PROBE TEST PADS Public/Granted day:2021-03-04
Information query
IPC分类:
