Invention Grant
- Patent Title: Semiconductor device, and associated method and system
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Application No.: US16849985Application Date: 2020-04-15
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Publication No.: US11309247B2Publication Date: 2022-04-19
- Inventor: Shih-Wei Peng , Wei-Cheng Lin , Jiann-Tyng Tzeng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/8234 ; H01L23/522 ; H01L27/088

Abstract:
A semiconductor device, including: a substrate, a transistor layer, a dielectric layer, and a power grid structure. The transistor layer is formed on a first side of the substrate and includes a plurality of active regions for forming transistors. The dielectric layer is formed on the transistor layer and includes a conductive strip disposed on a first active region and extending toward a second active region for signal connection. The power grid structure is formed on a second side of the substrate opposite to the first side and arranged to direct a power source to the transistor layer.
Public/Granted literature
- US20210134720A1 SEMICONDUCTOR DEVICE, AND ASSOCIATED METHOD AND SYSTEM Public/Granted day:2021-05-06
Information query
IPC分类: