Invention Grant
- Patent Title: Electronic module
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Application No.: US16060279Application Date: 2017-05-19
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Publication No.: US11309273B2Publication Date: 2022-04-19
- Inventor: Kosuke Ikeda , Osamu Matsuzaki
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2017/018835 WO 20170519
- International Announcement: WO2018/211686 WO 20181122
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495 ; H01L25/07

Abstract:
An electronic module has a first substrate 11, a first electronic element 13 provided on one side of the first substrate 11, a first connection body 60 provided on one side of the first electronic element 13, a second electronic element 23 provided on one side of the first connection body 60, a second substrate 21 provided on one side of the second electronic element 23, and an abutment body 250 that abuts on a face on one side of the second electronic element 23 and is capable of imparting a force toward one side with respect to the second substrate 21.
Public/Granted literature
- US20210175198A1 ELECTRONIC MODULE Public/Granted day:2021-06-10
Information query
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