The present disclosure provides a method for manufacturing a semiconductor package. The method includes steps of providing semiconductor wafer having a plurality of device chips disposed thereon, wherein each of the plurality of device chips has an active area and an inactive area arranged around the active area; forming a plurality of the openings, wherein each of the plurality of openings is formed in a back surface of the semiconductor wafer and forms an opening into the inactive area; and disposing a protecting material within the openings and over the back surface of the semiconductor wafer.