Invention Grant
- Patent Title: Semiconductor device package
-
Application No.: US16551180Application Date: 2019-08-26
-
Publication No.: US11309295B2Publication Date: 2022-04-19
- Inventor: Wen Hung Huang , Wen Chieh Yang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L25/16 ; H01L23/538 ; H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L21/48 ; H01L21/683
Abstract:
A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.
Public/Granted literature
- US20210066264A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-03-04
Information query
IPC分类:
