An integrated circuit is disclosed, including a first conductive pattern and a second conductive pattern that are disposed in a first layer and extend in a first direction, at least one first conductive segment disposed in a second layer different from the first layer, and at least one via disposed between the first layer and the second layer. The at least one via is coupled between the at least one first conductive segment and one or both of the first conductive pattern and the second conductive pattern, at an output node of the integrated circuit. The at least one via comprises a tapered shape with a width that decreases from a first width to a second width narrower than the first width. The first width of the at least one via is greater than widths of the first conductive pattern and the second conductive pattern.