Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US16674312Application Date: 2019-11-05
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Publication No.: US11309387B2Publication Date: 2022-04-19
- Inventor: Tse-Yao Huang
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L25/07 ; H01L25/00

Abstract:
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a first semiconductor stack having a first threshold voltage and comprising a first insulating stack positioned on the substrate, a second semiconductor stack having a second threshold voltage and comprising a second insulating stack positioned on the substrate, and a third semiconductor stack having a third threshold voltage and comprising a third insulating stack positioned on the substrate. The first threshold voltage, the second threshold voltage, and the third threshold voltage are different from each other, a thickness of the first insulating stack is different from a thickness of the second insulating stack and a thickness of the third insulating stack, and the thickness of the second insulating stack is different from the thickness of the third insulating stack.
Public/Granted literature
- US20210134953A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-05-06
Information query
IPC分类: