Invention Grant
- Patent Title: Vertical Schottky barrier diodes using two-dimensional layered semiconductors and fabrication methods thereof
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Application No.: US17006239Application Date: 2020-08-28
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Publication No.: US11309437B2Publication Date: 2022-04-19
- Inventor: Seongil Im , Sung Jin Yang
- Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
- Applicant Address: KR Seoul
- Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
- Current Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
- Current Assignee Address: KR Seoul
- Agency: McCoy Russell LLP
- Priority: KR10-2019-0105778 20190828
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/66

Abstract:
Provided are a vertical Schottky barrier diode using a two-dimensional layered semiconductor and a fabrication method thereof, the vertical Schottky barrier diode having excellent response characteristics in a high frequency region and capable of being directly fabricated from a material having a low melting point such as glass or plastic because its fabrication process is performed at a relatively low temperature. The vertical Schottky barrier diode includes: an ohmic contact layer formed of a metal; a two-dimensional layered semiconductor formed of two-dimensional transition metal dichalcogenides (TMDs) on one surface of the ohmic contact layer; a Schottky contact layer formed on one surface of the two-dimensional layered semiconductor; and a non-conductive layer formed on the other surface of the ohmic contact layer or one surface of the Schottky contact layer.
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