Invention Grant
- Patent Title: Array substrate and fabrication method thereof
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Application No.: US16617324Application Date: 2019-11-11
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Publication No.: US11309470B2Publication Date: 2022-04-19
- Inventor: Yong Fan
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: CN201910892656.1 20190920
- International Application: PCT/CN2019/117169 WO 20191111
- International Announcement: WO2021/051535 WO 20210325
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L27/15 ; H01L33/38

Abstract:
An array substrate and a method of fabricating the array substrate are disclosed. The array substrate includes a substrate including a plurality of pixel units arranged in an array. Each of the pixel units has a first electrode and a second electrode, and a first gap is provided between the first electrode and the second electrode. A bonding adhesive is disposed at the first gap. A micro light-emitting diode is disposed on the first electrode, the second electrode, and the bonding adhesive to prevent a failure of the micro light-emitting diode and improve product yield.
Public/Granted literature
- US20210336106A1 ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF Public/Granted day:2021-10-28
Information query
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