Invention Grant
- Patent Title: Transistor manufacturing method
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Application No.: US16374805Application Date: 2019-04-04
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Publication No.: US11309503B2Publication Date: 2022-04-19
- Inventor: Shohei Koizumi , Takashi Sugizaki , Yusuke Kawakami
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2013-240613 20131121
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L51/05 ; H01L21/02 ; H01L21/28 ; H01L21/288 ; H01L29/786 ; C23C18/31 ; C23C18/32 ; C23C28/00 ; C23C18/16 ; H01L29/45 ; H01L29/49 ; H01L27/12 ; G03F7/20 ; G03F7/32 ; G03F7/40 ; C23C18/30 ; C23C18/34 ; C23C18/42

Abstract:
A transistor manufacturing method includes forming a source electrode and a drain electrode on a substrate, forming a layer including an insulator layer to cover the source electrode and the drain electrode, and forming a gate electrode on the layer including the insulator layer, wherein the forming the gate electrode includes forming a plating base film, forming a protection layer of the plating base film, forming a photoresist layer on the protection layer to expose the photoresist layer with desired patterning light, causing the exposed photoresist layer to come into contact with a developer to remove the photoresist layer and the protection layer until the plating base film is uncovered corresponding to the patterning light, and after depositing a metal on the uncovered plating base film, causing an electroless plating solution to come into contact with the plating base film to perform electroless plating.
Public/Granted literature
- US20190229283A1 TRANSISTOR MANUFACTURING METHOD Public/Granted day:2019-07-25
Information query
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