Invention Grant
- Patent Title: Substrate connecting structure
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Application No.: US17038712Application Date: 2020-09-30
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Publication No.: US11309643B2Publication Date: 2022-04-19
- Inventor: Masato Oda , Yuto Sato
- Applicant: JTEKT CORPORATION
- Applicant Address: JP Osaka
- Assignee: JTEKT CORPORATION
- Current Assignee: JTEKT CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Oliff PLC
- Priority: JPJP2019-187919 20191011
- Main IPC: H01R12/52
- IPC: H01R12/52 ; H01R12/58 ; H01R13/05 ; H05K5/00 ; H02K11/33 ; H02K5/22

Abstract:
A substrate connecting structure includes a first substrate, a second substrate facing the first substrate, and a terminal through which electricity is supplied to the first substrate and the second substrate. The terminal has a first substrate connecting part that is connected to the first substrate from a side opposite from the second substrate, and a second substrate connecting part that is provided by splitting from the first substrate connecting part at an intermediate point in the terminal and connected to the second substrate by extending contactlessly through the first substrate from the side opposite from the second substrate toward the second substrate.
Public/Granted literature
- US20210111501A1 SUBSTRATE CONNECTING STRUCTURE Public/Granted day:2021-04-15
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