Invention Grant
- Patent Title: Radio-frequency module, transmission power amplifier, and communication apparatus
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Application No.: US17224154Application Date: 2021-04-07
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Publication No.: US11309925B2Publication Date: 2022-04-19
- Inventor: Sho Matsumoto , Takanori Uejima , Yuji Takematsu , Tetsuro Harada , Dai Nakagawa , Naoya Matsumoto , Yutaka Sasaki , Yuuki Fukuda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2018-207003 20181102
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/44

Abstract:
A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.
Public/Granted literature
- US20210226652A1 RADIO-FREQUENCY MODULE, TRANSMISSION POWER AMPLIFIER, AND COMMUNICATION APPARATUS Public/Granted day:2021-07-22
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