The invention relates to a semiconductor component (2), comprising a semiconductor chip (3), a housing (5) and a connection point arrangement (10) having at least two rows (14, 16) of planar connection points (12), which are arranged on a bottom side of the housing (5) and can be electrically connected by means of connections to corresponding contacts of a contact arrangement having at least two rows, which contact arrangement is arranged on a printed circuit board, wherein the geometry of the contact arrangement corresponds to the geometry of the connection point arrangement (10), a first distance is specified between two adjacent first connection points (14A) of a first row (14) of the connection point arrangement (10) and a second distance is specified between two adjacent second connection points (16A) of a second row (16) of the connection point arrangement (10), and the second connection points (16A) of the second row (16) are offset to the first connection points (14A) of the first row (14). The invention also relates to a corresponding contacting assembly having such a semiconductor element (2) and a printed circuit board. The first distance at least between two adjacent first connection points (14A) of the first row (14) of the connection point arrangement (10) corresponds to an intermediate space (C, D) between two contacts of the corresponding contact arrangement, in which intermediate space at least two conducting tracks (28) having functionally reliable dimensions and distances can be arranged.