Invention Grant
- Patent Title: Soldering apparatus
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Application No.: US17409405Application Date: 2021-08-23
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Publication No.: US11311956B2Publication Date: 2022-04-26
- Inventor: Kazunari Soma
- Applicant: SENJU METAL INDUSTRY CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2020-150298 20200908
- Main IPC: B23K3/04
- IPC: B23K3/04 ; H05K3/00 ; B23K1/00 ; B23K1/008 ; B23K1/012 ; H05K3/34 ; B23K101/42

Abstract:
Provided is a soldering apparatus capable of blowing gas through a first blowing port more uniformly than a conventional apparatus, at each position in the first blowing port. The soldering apparatus according to the present disclosure is a soldering apparatus that performs soldering, including a blowing unit that supplies gas to an object, wherein the blowing unit includes a case including a first blowing chamber, a fan housed in the first blowing chamber to blow the gas in a centrifugal direction, a first baffle plate, and a heater that heats the gas or a cooling unit that cools the gas, the case includes a first wall that faces the fan in an axial direction of the fan, a second wall that faces the first wall, and an inner wall connecting the first wall and the second wall, the first wall, the second wall and the inner wall define the first blowing chamber, in the first wall, a first blowing port is formed, and the first baffle plate is disposed in the first blowing chamber to guide part of the gas blown from the fan to the first blowing port.
Public/Granted literature
- US20220072641A1 Soldering Apparatus Public/Granted day:2022-03-10
Information query
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