Invention Grant
- Patent Title: Resins, multilayer films and packages comprising the same
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Application No.: US16612188Application Date: 2018-07-02
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Publication No.: US11312119B2Publication Date: 2022-04-26
- Inventor: Eduardo Alvarez , Yushan Hu , David Lopez , Marcello Tognola
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Priority: EP17382469 20170718,EP17382525 20170731
- International Application: PCT/US2018/040615 WO 20180702
- International Announcement: WO2019/018127 WO 20190124
- Main IPC: B32B27/32
- IPC: B32B27/32 ; B32B1/02 ; B32B27/08 ; B65D65/40 ; C08L23/14

Abstract:
The present invention provides resins for use as a sealant layer in a multilayer film, multilayer films, and packages formed from such films. In one aspect, a resin for use as a sealant layer in a multilayer film comprises (a) 10 to 30 weight percent low density polyethylene based on the total weight of the resin; (b) 60 weight percent or more of a random copolymer polypropylene based on the total weight of the resin; and (c) 5 to 25 weight percent of a crystalline block copolymer composite (CBC) comprising: i) a crystalline ethylene based polymer (CEP) comprising at least 90 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP); and iii) a block copolymer comprising (1) a crystalline ethylene block (CEB) comprising at least 90 mol % polymerized ethylene and (2) a crystalline alpha-olefin block (CAOB).
Public/Granted literature
- US20210078314A1 RESINS, MULTILAYER FILMS AND PACKAGES COMPRISING THE SAME Public/Granted day:2021-03-18
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