Invention Grant
- Patent Title: Vacuum lamination system and vacuum lamination method
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Application No.: US16924145Application Date: 2020-07-08
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Publication No.: US11312123B2Publication Date: 2022-04-26
- Inventor: Ching-Nan Chang , Sheng-Yu Lin , Ming-Chan Chen
- Applicant: ELEADTK CO., LTD.
- Applicant Address: TW Hsinchu County
- Assignee: ELEADTK CO., LTD.
- Current Assignee: ELEADTK CO., LTD.
- Current Assignee Address: TW Hsinchu County
- Agency: JCIP Global Inc.
- Priority: TW109117478 20200526
- Main IPC: B30B5/02
- IPC: B30B5/02 ; B32B37/10 ; B32B38/18 ; B32B37/06 ; B32B38/00 ; B32B38/04

Abstract:
A vacuum lamination system includes a film supply assembly, a film collection assembly, a lower lamination body, an upper lamination body, an air extractor, a moving assembly and a cutting assembly. The lower lamination body includes a first casing base and a lower heating assembly vertically movable and disposed in the first casing base. The lower heating assembly carries and moves the substrate so that the substrate is substantially flush with a top surface of the first casing base or retracted into the first casing base. The upper lamination body is vertically movable and disposed above the lower lamination body and includes an upper casing and an upper heating assembly disposed on the upper casing. The air extractor is connected to the lower lamination body. The moving assembly changes a height of a portion of the film. The cutting assembly cuts a portion of the film laminated onto the substrate.
Public/Granted literature
- US20210370657A1 VACUUM LAMINATION SYSTEM AND VACUUM LAMINATION METHOD Public/Granted day:2021-12-02
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