Invention Grant
- Patent Title: Logic circuitry package
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Application No.: US16768626Application Date: 2019-10-25
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Publication No.: US11312146B2Publication Date: 2022-04-26
- Inventor: Quinton B. Weaver , James Michael Gardner , David N. Olsen , Anthony D. Studer
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dicke, Billig & Czaja, PLLC
- International Application: PCT/US2019/057980 WO 20191025
- International Announcement: WO2020/117391 WO 20200611
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/045 ; G06F13/42 ; G06F21/44 ; G01F23/00 ; G06F1/12 ; G06F1/08 ; H03K19/0175 ; B33Y30/00 ; B29C64/259 ; G06F3/12 ; G01F23/24 ; G01F23/80

Abstract:
A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit, and at least one logic circuit to receive, via the interface, requests corresponding to different sensor IDs with the component connected to the apparatus. The logic circuit is to transmit, via the interface, a digital value in response to each request. The digital values corresponding to the different sensor IDs are distinct.
Public/Granted literature
- US20220080738A9 LOGIC CIRCUITRY PACKAGE Public/Granted day:2022-03-17
Information query
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