Invention Grant
- Patent Title: Easy-to-tear flexible packaging substrate
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Application No.: US17252624Application Date: 2019-06-21
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Publication No.: US11312551B2Publication Date: 2022-04-26
- Inventor: Ashok Chaturvedi
- Applicant: Ashok Chaturvedi
- Applicant Address: IN New Delhi
- Assignee: Ashok Chaturvedi
- Current Assignee: Ashok Chaturvedi
- Current Assignee Address: IN New Delhi
- Agency: Dinsmore & Shohl, LLP
- Priority: IN201811023315 20180622
- International Application: PCT/IN2019/050466 WO 20190621
- International Announcement: WO2019/244172 WO 20191226
- Main IPC: B65D65/40
- IPC: B65D65/40 ; B32B3/30 ; B32B7/12 ; B32B15/08 ; B32B27/08 ; B32B27/10 ; B32B27/30 ; B32B27/32 ; B32B27/34 ; B32B27/36

Abstract:
The present invention describes easy-to-tear polymeric flexible packaging substrate i.e. polymeric film/laminate. The easy-to-tear flexible packaging film is obtained by providing a plurality of non-through micro-indentations on one or both surface of the film. The micro-indentations are located over the entire or partial surface area of the film. The easy-to-tear packaging laminate of the present invention is obtained by providing a plurality of non-through micro-indentations on at least one surface of at least one layer of the packaging laminate. The micro-indentations are located over the entire or partial surface area of the corresponding surfaces of the layers of the laminate. The micro-indentations may have a depth between 1˜70% of the thickness of the polymeric layer. The density of the micro-indentations on a particular surface may be from 10/cm2 to 10,000/cm2.
Public/Granted literature
- US20210179329A1 EASY-TO-TEAR FLEXIBLE PACKAGING SUBSTRATE Public/Granted day:2021-06-17
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