Invention Grant
- Patent Title: Polymerizable composition and molded product
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Application No.: US16491080Application Date: 2018-03-07
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Publication No.: US11312857B2Publication Date: 2022-04-26
- Inventor: Motoharu Oiki , Koju Okazaki
- Applicant: Mitsui Chemicals, Inc.
- Applicant Address: JP Tokyo
- Assignee: Mitsui Chemicals, Inc.
- Current Assignee: Mitsui Chemicals, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JPJP2017-043493 20170308
- International Application: PCT/JP2018/008820 WO 20180307
- International Announcement: WO2018/164194 WO 20180913
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08G18/02 ; C08G18/48 ; C08L71/02 ; C08L83/12 ; G02B1/04 ; C08G18/28 ; C08G18/38 ; C08G18/72 ; C08G18/73 ; C08G18/75 ; C08G18/24 ; C08G18/76 ; B29C33/64 ; C08G65/336 ; C08L83/10 ; C08L75/04 ; C08L101/00 ; C08G59/20 ; C08G77/46

Abstract:
A polymerizable composition of the present invention includes a polymerization reactive compound (A), and an internal release agent (B) including a polyether-modified silicone compound (b1) represented by General Formula (1) and a polyether-modified silicone compound (b2) represented by General Formula (2), in which the polymerization reactive compound (A) is one or more compounds selected from a polyiso(thio) cyanate compound, a poly(thio) epoxy compound, a polyoxetanyl compound, a polythietanyl compound, an alkyne compound, a poly(thi)ol compound, a polyamine compound, an acid anhydride, or a polycarboxylic acid compound.
Public/Granted literature
- US20200010665A1 POLYMERIZABLE COMPOSITION AND MOLDED PRODUCT Public/Granted day:2020-01-09
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