Invention Grant
- Patent Title: Heat pipe
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Application No.: US16985715Application Date: 2020-08-05
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Publication No.: US11313626B2Publication Date: 2022-04-26
- Inventor: Lei Lei Liu , Xue Mei Wang
- Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Applicant Address: CN Hui Zhou
- Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Current Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
- Current Assignee Address: CN Hui Zhou
- Agency: Maschoff Brennan
- Priority: CN202010196720.5 20200319
- Main IPC: F28D15/04
- IPC: F28D15/04

Abstract:
This disclosure relates to a heat pipe includes a tubular body and a capillary structure. The tubular body has an inner surface. The inner surface forms a sealed chamber. The capillary structure is located in the sealed chamber and arranged on the inner surface. The tubular body includes a condensation section and an evaporation section connected to each other. The capillary structure includes a cold section and a heat section connected to each other. The cold section is disposed on the condensation section, and the heat section is disposed on the evaporation section. A wall thickness of the cold section is greater than a wall thickness of the heat section.
Public/Granted literature
- US20210293486A1 HEAT PIPE Public/Granted day:2021-09-23
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