Invention Grant
- Patent Title: Sensor and sensor assemblies for a thermometer
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Application No.: US16419586Application Date: 2019-05-22
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Publication No.: US11313733B2Publication Date: 2022-04-26
- Inventor: Hiroyuki Masaki , Tomoyo Maeshima
- Applicant: Hakko Corporation
- Applicant Address: JP Osaka
- Assignee: Hakko Corporation
- Current Assignee: Hakko Corporation
- Current Assignee Address: JP Osaka
- Agent David B. Abel
- Main IPC: G01K7/02
- IPC: G01K7/02 ; B23K3/03 ; G01K1/14 ; H01L35/30 ; H01L35/32 ; G01K1/00 ; G01K1/08
Abstract:
The invention is directed to embodiments of a temperature sensor for use with a temperature measuring device, for example a digital thermometer. The temperature sensor includes at least two and preferably three wires joined at a thermocouple. The temperature sensor is designed to be mounted on terminals of the digital thermometer sensor to allow precise temperature measurements for a thermal device, for example a soldering tool or de-soldering tool.
Information query
