A TEM electromechanical in-situ testing method of one-dimensional materials is provided. A multi-function sample stage which can compress, buckle and bend samples is designed and manufactured. A carbon film on a TEM grid of Cu is eliminated, and the TEM grid of Cu is cut in half through the center of the circle. The samples are dispersed ultrasonically in alcohol and dropped on the edge of the semicircular grid of Cu with a pipette. A single sample is fixed on the edge of a substrate of the sample stage with conductive silver epoxy by using a micromechanical device under an optical microscope, and conductive silver paint is applied to the surface of the substrate of the sample stage; and an electromechanical in-situ testing is conducted in a TEM. This provides a simple and efficient sample preparation and testing method for a TEM electromechanical in-situ observing experiment.