The present invention provides a forming apparatus that forms a composition on a substrate using a mold including a contact region to be brought into contact with the composition, comprising: a deformation unit configured to deform the contact region; and a controller configured to perform, for each of a first shot region and a second shot region on the substrate, a process of bringing the contact region and the composition on the substrate into contact with each other while controlling the deformation of the contact region, wherein an area where the mold faces the substrate during the process is different between the first and second shot regions, and wherein the controller is configured to change, between the first and second shot regions, a process condition for bringing the contact region and the composition into contact with each other.