Provided is an apparatus which is advantageous in view of reduction of consumption of a replacement gas. An apparatus for forming a pattern on a substrate using a mold includes a gas supply unit, a positioning unit and a controller. The controller controls a gas supply unit and a positioning unit and, causes second contact between a second shot region different from a first shot region and the mold after first contact between a first shot region having a material supplied thereon among the plurality of shot regions and the mold and controls the positioning unit so that a second gap which is the distance at the time of changing a relative position between the mold and the substrate in a surface direction from the first shot region to the second shot region is shorter than a first gap which is the distance at the time of gas supply.