A touch substrate has a touch sensing area, and a peripheral area for bonding circuit parts. The touch substrate includes a first touch electrode layer including a plurality of first touch electrodes; a second touch electrode layer including a plurality of second touch electrodes; an insulating layer insulating the first touch electrode layer from the second touch electrode layer; a plurality of first touch signal lines extending across at least a portion of the touch sensing area into the peripheral area; and a plurality of vias extending through the insulating layer. The plurality of first touch signal lines are respectively connected to the plurality of first touch electrodes respectively through the plurality of vias. The plurality of first touch signal lines and the plurality of second touch electrodes are in a same layer.