Invention Grant
- Patent Title: Substrate processing device and substrate processing method
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Application No.: US16801193Application Date: 2020-02-26
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Publication No.: US11315820B2Publication Date: 2022-04-26
- Inventor: Tetsuo Ito , Noriyuki Kikumoto , Kazuki Inoue , Kunio Yamada
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: JCIPRNET
- Priority: JPJP2019-063854 20190328
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/02
Abstract:
A substrate processing device is provided. A chamber has a side wall part and a top wall part and contains a substrate holding part. A first gas supply part is disposed in the top wall part and supplies a first gas toward a side on which the substrate holding part is positioned. A second gas supply part is contained in the chamber and supplies a second gas to an inside of the chamber. A control unit controls the first and second gas supply part. The second gas is a gas different from oxygen and an allotrope of oxygen. The second gas supply part has an air feeding port part which is positioned on an upward side of a holding position of a substrate by the substrate holding part in a vertical direction and is positioned on an outward side of the substrate holding part in a horizontal direction.
Public/Granted literature
- US20200312697A1 SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND SEMICONDUCTOR MANUFACTURING METHOD Public/Granted day:2020-10-01
Information query
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