Invention Grant
- Patent Title: Electronic device mounting board, electronic package, and electronic module
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Application No.: US17050672Application Date: 2019-01-31
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Publication No.: US11315844B2Publication Date: 2022-04-26
- Inventor: Fumiaki Takeshita , Teruaki Nonoyama
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JPJP2018-085339 20180426
- International Application: PCT/JP2019/003377 WO 20190131
- International Announcement: WO2019/207884 WO 20191031
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/15 ; H05K1/11
Abstract:
A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.
Public/Granted literature
- US20210242099A1 ELECTRONIC DEVICE MOUNTING BOARD, ELECTRONIC PACKAGE, AND ELECTRONIC MODULE Public/Granted day:2021-08-05
Information query
