Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing semiconductor devices
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Application No.: US16665550Application Date: 2019-10-28
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Publication No.: US11315875B2Publication Date: 2022-04-26
- Inventor: Ki Yeul Yang , Kyung Han Ryu , Hyun Cho
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Valley Point #12/203
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Valley Point #12/203
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L23/498 ; H01L23/538

Abstract:
Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.
Public/Granted literature
- US20210125934A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES Public/Granted day:2021-04-29
Information query
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